How To Improve The Soldering Quality Of Automatic Soldering Machines?

The basic principle of automatic soldering machines is to use robotic arms to replace manual soldering operations. The control system primarily relies on PLC or industrial control boards, and the motion system is driven by motors operating belt guides, ball screws, cylinders, and other mechanisms to achieve precise control.

Automatic soldering machines are divided into specialized and general-purpose types.

Specialized automatic soldering machines are designed for a specific type of product, such as USB soldering machines or DC connector soldering machines, tailored for a single product or product series.

General-purpose automatic soldering machines have a broader range of applications, including pin headers, metal shells, connectors, and various through-hole electronic components such as capacitors, resistors, pin headers, flat cables, screens, covers, and other plug-in components. However, general-purpose machines are not all-powerful; they have certain limitations and must be selected according to actual requirements. In terms of efficiency, one automatic soldering machine typically achieves 1–2 times the productivity of manual soldering. In practical use, a single operator can handle 1–4 machines simultaneously, significantly improving labor efficiency and achieving labor-saving goals.

Methods and Techniques to Improve Soldering Quality

1. Fast-Recovery Soldering Tip

The high-precision heating core imported from Germany is located at the very tip of the soldering iron, enabling it to detect subtle temperature changes at the tip. The temperature can reach 450°C within 6 seconds. The positioning design of the soldering tip allows for quick and easy replacement, and the variety of tip shapes enables rapid solutions for complex soldering tasks.

2. Anti-Explosion Solder Feeding System

During precise solder feeding, blade-shaped gears create tiny holes on the side of the solder wire, allowing flux to seep out. This significantly reduces solder splashing ("solder explosion") caused by flux boiling, ensuring clean solder joints and minimizing the effect of solder balls on other sensitive areas of the PCB.

If solder balls are not properly managed, it may cause serious issues in sealed electronic devices.

3. Auxiliary Solder Feeding Function

By adjusting the vertical position of the positioning mechanism, the secondary solder feeding point at the tip of the soldering iron can be modified. The first-stage solder feed, the tip is preloaded with solder, allowing the flux to act more quickly and effectively, ensuring optimal soldering quality.

4. Instant Solder Tip Cleaning

The automatic solder tip cleaning system with chrome-iron tip on the machine can be fully configured according to product soldering requirements, adjusting the air-blowing frequency to clean the tip. This system is suitable for both lead-free and leaded solder.