Description
Technical Parameters
Description
Laser welding machine for solder ball can be widely used in the following application areas:
CCM camera and module, gold finger/FPC, wire, communication devices, optical devices, fuse industry, semiconductor industry soldering.
Product Advantages
- Heating and melting drop process is fast, can be completed within 0.2s.
- Finish melting of tin ball inside the soldering nozzle, no splash.
- No flux, no pollution, maximize the life of electronic devices.
- Tin ball diameter of minimum 0.15mm, in line with the integration and precision development trend.
- Through the selection of the size of the solder ball to complete the welding of different solder joints.
- Stable welding quality and high yield rate.
- With CCD positioning system suitable for assembly line mass production needs.
- UPH ≥ 8000 points, yield rate ≥ 99% (related to the product).
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