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Product Description:
This equipment realizes non-contact solder ball jet welding with tiny pitch, featuring accurate positioning, fast welding, stable quality, low thermal stress and no-clean;
It is mainly composed of laser system, ball supply system, image recognition and detection system, nitrogen protection system, mechanism and motion system and computer control system;
It is widely used in the welding of all kinds of electronic components, especially suitable for the welding of high precision micro products of 3C electronic components.
Application Fields:
The equipment can be widely used in the welding of all kinds of electronic components, especially suitable for 3C electronic components of high precision micro-products welding, such as BGA, VCM (Voice Coil Motor), CCM (Camera Module), HDD (Hard Disk Drive) and so on.
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