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Laser Solder Ball Welding Machine with Dual StationsReturn

Application Range:


Laser solder ball welding to achieve precision: PCB pads and gold finger solder connection, FPC and PCB welding, wire and PCB welding, part of the THT plug-in device welding.

Products with PINs on one side and products with PINs on both sides of the opposite side, and a variety of other precision soldering.


Laser Solder Ball Welding Machine with Dual Stations
  • Product Details
  • Product Specifications

Application Areas:

CCM camera/module, gold finger/FPC, wire, communication devices, optical devices, fuse industry, semiconductor industry soldering



Product Advantages:

1. Heating and melting drop process is fast, can be completed within 0.2s;

2. Finish melting of tin ball inside the soldering nozzle, no splash;

3. No flux, no pollution, maximize the life of electronic devices;

4. Tin ball diameter of minimum 0.15mm, in line with the integration and precision development trend;

5. Through the selection of the size of the solder ball to complete the welding of different solder joints;

6. Stable welding quality and high yield rate;

7. With CCD positioning system suitable for assembly line mass production needs;

8. UPH ≥ 8000 points, yield rate ≥ 99% (related to the product).

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