Application Areas:

CCM camera/module, gold finger/FPC, wire, communication devices, optical devices, fuse industry, semiconductor industry soldering

Product Advantages:

1. Heating and melting drop process is fast, can be completed within 0.2s;

2. Finish melting of tin ball inside the soldering nozzle, no splash;

3. No flux, no pollution, maximize the life of electronic devices;

4. Tin ball diameter of minimum 0.15mm, in line with the integration and precision development trend;

5. Through the selection of the size of the solder ball to complete the welding of different solder joints;

6. Stable welding quality and high yield rate;

7. With CCD positioning system suitable for assembly line mass production needs;

8. UPH ≥ 8000 points, yield rate ≥ 99% (related to the product).