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Program for the Whole Process of SMT Production LineReturn

SMT equipment is actually the machines needed for surface mount technology, generally a SMT whole line routinely contains the following equipment:

Program for the Whole Process of SMT Production Line
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Loading machine, printing machine, docking station, SPI, mounter, plug-in machine, reflow soldering, wave soldering, AOI, X-ray, unloader and other equipment.

The above equipment is a more complete list of smt assembly line equipment, different factories can be based on the actual product needs to add or delete related equipment, must have the equipment contains printing machine, mounter, reflow soldering.


SMT production equipment: dispensing machine, solder paste printer, mounter, reflow soldering, wave soldering;

SMT testing equipment: SPI solder paste thickness tester, oven temperature profile tester, AOI optical tester, ICT in-line tester, X-RAY testing system, ATE testing system;

SMT peripheral equipment: solder paste mixer, connecting table, board separator, board loading and unloading machine, loading and unloading machine, cache machine;

SMT accessories: thermocouples / RTDs, heating tubes, scrapers / templates, suction nozzles, dispensing needles, dispenser barrel accessories, wave soldering foam tubes;

SMT soldering consumables: solder paste / solder bar, patch adhesive, flux;

SMT electric tools: anti-static soldering iron, tin soldering iron, molten tin furnace, stay chip pliers, foam furnace;

SMT cleaning equipment: ultrasonic cleaning machine, PCBA cleaning machine;

Anti-static products: anti-static human body protection, anti-static tools, anti-static turnover box, anti-static packaging, anti-static testing instrument;


Electronic products are characterized by seamless production lines, highly standardized and highly automated production processes.

The production of electronic modules with regard to fully filled and soldered circuit substrates as well as the manufacture of electronic products is understood as the mounting of electrical components in a housing.  

Surface Mount Technology (SMT), this technology utilizes the same methods as insertion packaging technology, press-in technology, or other process technologies in electronics manufacturing.

The surface mount technology consists of the steps of solder paste application, component filling and reflow soldering.

This is followed by inspection steps and handling processes, often combined with highly automated logistic processes, as shown in the figure illustrating the SMD (Surface Mount Device) process chain with common inspection steps.

In this way, the product can run on a conveyor belt every second.


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